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3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure

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Dongguan Ziitek Electronical Material and Technology Ltd.

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3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure

Name: 30mmT Thermal Gap Pad 18 WMK 25shore00 For IT Infrastructure
Brand: Ziitek
Price: 0.1 USD

Quality 3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure wholesale

Brand Name : Ziitek

Model Number : TIF5120-18-11US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

hardness : 25shore00

KEYWORD : grey silicone rubber pads

color : grey

part number : TIF5120-18-11US

material : silicone

thermal conductive : 1.8 W/mK

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3.0mmT high cost-effective thermal gap pad 1.8 W/MK 25shore00 For IT infrastructure

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF500-18-11US Datasheet-REV02.pdf

Ziitek TIF5120-18-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

<Good thermal conductive: 1.8 W/mK

<Thickness:3.0mmT

< release construction

<Outstanding thermal performance

<Soft and compressible for low stress applications

<Naturally tacky needing no further adhesive coating

Applications

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

<Semiconductor automated test equipment (ATE)

<CPU

<display card

<mainboard/mother board

<notebook

Typical Properties of TIF5120-18-11US
Product Name	TIF5120-18-11US Series
Colour	Grey
Construction & Compostion	Ceramic filled silicone rubber
Specific Gravity	2.8 g/cc
Dielectric Constant@1MHz	4.2 MHz
Hardness	20 Shore 00
Flame Rating	94 -V0
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	1.8 W/mK
Thickness	3.0mmT

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ:

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

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3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure

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