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Durable Silicone Thermal Conductive Cooling Insulator Pad For Laptop CPU Gap Filling Materials With Fiberglass

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Durable Silicone Thermal Conductive Cooling Insulator Pad For Laptop CPU Gap Filling Materials With Fiberglass

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Brand Name : Ziitek

Model Number : TIS809-09-01

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/pcs

Delivery Time : 3-6 work days

Packaging Details : 24*13*12cm cartons

Product name : Durable Silicone Thermal Conductive Cooling Insulator Pad For Laptop CPU Gap Filling Materials With Fiberglass

Thermal conductive : 0.9W/mK

Application : Car Battery & Laptop CPU

continous use temp : -60 to 180℃

compliance : UL & RoHS

Materials : Ceramic filled silicone elastomer / Fiberglass

Feature : Low thermal resistant with high voltage isolation

keyword : Thermal Insulator Pad

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Durable Silicone Thermal Conductive Cooling Insulator Pad For Laptop CPU Gap Filling Materials With Fiberglass

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

The TIS®809-09-01 Series of products are highly efficient insulating products and they alsohave thermal conductivity. It achieves the effect of both insulation and heat conduction byadding insulating silicone base material to the heat-conducting material.


Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

Typical Properties of TIS®809-09-01 Series
Property Value Test Method
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer /fiberglass ******
Thickness range 0.009inch (0.229mm) ASTM D374
Tensile Strength(MPa) 50 ASTM D412
Density 2.4 g/cc ASTM D297
Continuos Use Temp -60 to 180℃ ******
Breakdown Voltage(V/mm) 4500 ASTM D149
Dielectric Constant @ 1MHz 5.5 ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 0.9W/m-K ASTM D5470
Thermal impedance(℃-in²/W)@30psi 1.73 ASTM D5470

Standard Thicknesses

0.009inch (0.229mm)

Standard Sizes
12" x 160"(304mm x 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

Durable Silicone Thermal Conductive Cooling Insulator Pad For Laptop CPU Gap Filling Materials With Fiberglass

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.


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Durable Silicone Thermal Conductive Cooling Insulator Pad For Laptop CPU Gap Filling Materials With Fiberglass Images

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